Thermal Cycling Fatigue Investigation of Surface Mounted Components with Eutectic Tin-Lead Solder Joints

Persistent Link:
http://hdl.handle.net/10150/611418
Title:
Thermal Cycling Fatigue Investigation of Surface Mounted Components with Eutectic Tin-Lead Solder Joints
Author:
Bonner, J. K. "Kirk"; de Silveira, Carl
Affiliation:
California Institute of Technology
Issue Date:
1996-10
Rights:
Copyright © International Foundation for Telemetering
Collection Information:
Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.
Publisher:
International Foundation for Telemetering
Journal:
International Telemetering Conference Proceedings
Abstract:
Eutectic (63% tin-37% lead) or near-eutectic (40% tin-60% lead) tin-lead solder is widely used for creating electrical interconnections between the printed wiring board (PWB) and the components mounted on the board surface. For components mounted directly on the PWB mounting pads, that is, surface mounted components, the tin-lead solder also constitutes the mechanical interconnection. Eutectic solder has a melting point of 183°C (361°F). It is important to realize that its homologous temperature, defined as the temperature in degrees Kelvin over its melting point temperature (T(m)), also in degrees Kelvin, is defined as T/T(m). At room temperature (25°C = 298K), eutectic solder's homologous temperature is 0.65. It is widely acknowledged that materials having a homologous temperature ≥ 0.5 are readily subject to creep, and the solder joints of printed wiring assemblies are routinely exposed to temperatures above room temperature. Hence, solder joints tend to be subject to both thermal fatigue and creep. This can lead to premature failures during service conditions. The geometry, that is, the lead configuration, of the joints can also affect failure. Various geometries are better suited to withstand failure than others. The purpose of this paper is to explore solder joint failures of dual in-line (DIP) integrated circuit components, leadless ceramic chip carriers (LCCCs), and gull wing and J-lead surface mount components mounted on PWBs.
Keywords:
Eutectic tin-lead solder; solder composition; surface mounted component (SMC); dual in-line (DIP) package; leadless ceramic chip carrier (LCCC); gull wing leaded quad flatpack (QFP); J-lead leaded chip carrier; solder joint; solder joint lead compliance; printed wiring board (PWB); FR-4 epoxy/fiberglass PWB; printed wiring assembly (PWA); solder joint failure; solder joint reliability; thermal fatigue failure; creep failure; gull wing lead configuration; butt mount lead configuration; thermal cycling; coefficient of thermal expansion (CTE); difference in CTE; dwell time
Sponsors:
International Foundation for Telemetering
ISSN:
0884-5123; 0074-9079
Additional Links:
http://www.telemetry.org/

Full metadata record

DC FieldValue Language
dc.language.isoen_USen
dc.titleThermal Cycling Fatigue Investigation of Surface Mounted Components with Eutectic Tin-Lead Solder Jointsen_US
dc.contributor.authorBonner, J. K. "Kirk"en
dc.contributor.authorde Silveira, Carlen
dc.contributor.departmentCalifornia Institute of Technologyen
dc.date.issued1996-10-
dc.rightsCopyright © International Foundation for Telemeteringen
dc.description.collectioninformationProceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.en
dc.publisherInternational Foundation for Telemeteringen
dc.description.abstractEutectic (63% tin-37% lead) or near-eutectic (40% tin-60% lead) tin-lead solder is widely used for creating electrical interconnections between the printed wiring board (PWB) and the components mounted on the board surface. For components mounted directly on the PWB mounting pads, that is, surface mounted components, the tin-lead solder also constitutes the mechanical interconnection. Eutectic solder has a melting point of 183°C (361°F). It is important to realize that its homologous temperature, defined as the temperature in degrees Kelvin over its melting point temperature (T(m)), also in degrees Kelvin, is defined as T/T(m). At room temperature (25°C = 298K), eutectic solder's homologous temperature is 0.65. It is widely acknowledged that materials having a homologous temperature ≥ 0.5 are readily subject to creep, and the solder joints of printed wiring assemblies are routinely exposed to temperatures above room temperature. Hence, solder joints tend to be subject to both thermal fatigue and creep. This can lead to premature failures during service conditions. The geometry, that is, the lead configuration, of the joints can also affect failure. Various geometries are better suited to withstand failure than others. The purpose of this paper is to explore solder joint failures of dual in-line (DIP) integrated circuit components, leadless ceramic chip carriers (LCCCs), and gull wing and J-lead surface mount components mounted on PWBs.en
dc.subjectEutectic tin-lead solderen
dc.subjectsolder compositionen
dc.subjectsurface mounted component (SMC)en
dc.subjectdual in-line (DIP) packageen
dc.subjectleadless ceramic chip carrier (LCCC)en
dc.subjectgull wing leaded quad flatpack (QFP)en
dc.subjectJ-lead leaded chip carrieren
dc.subjectsolder jointen
dc.subjectsolder joint lead complianceen
dc.subjectprinted wiring board (PWB)en
dc.subjectFR-4 epoxy/fiberglass PWBen
dc.subjectprinted wiring assembly (PWA)en
dc.subjectsolder joint failureen
dc.subjectsolder joint reliabilityen
dc.subjectthermal fatigue failureen
dc.subjectcreep failureen
dc.subjectgull wing lead configurationen
dc.subjectbutt mount lead configurationen
dc.subjectthermal cyclingen
dc.subjectcoefficient of thermal expansion (CTE)en
dc.subjectdifference in CTEen
dc.subjectdwell timeen
dc.description.sponsorshipInternational Foundation for Telemeteringen
dc.identifier.issn0884-5123-
dc.identifier.issn0074-9079-
dc.identifier.urihttp://hdl.handle.net/10150/611418-
dc.identifier.journalInternational Telemetering Conference Proceedingsen
dc.typetexten
dc.typeProceedingsen
dc.relation.urlhttp://www.telemetry.org/en
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