Persistent Link:
http://hdl.handle.net/10150/609358
Title:
Microprocessor Controlled Thick-Film PCM Telemetry System
Author:
Hakimoglu, Demirhan
Affiliation:
Aydin Vector Division
Issue Date:
1975-10
Rights:
Copyright © International Foundation for Telemetering
Collection Information:
Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.
Publisher:
International Foundation for Telemetering
Journal:
International Telemetering Conference Proceedings
Abstract:
This paper describes an approach to airborne PCM data acquisition that takes advantage of the latest technological advances in the fields of both the monolithic microcircuits and hybrid packaging. The result is a low cost system that provides a combination of long sought-after features; flexibility, modular make-up, microminiature size, high reliability and low power.
Sponsors:
International Foundation for Telemetering
ISSN:
0884-5123; 0074-9079
Additional Links:
http://www.telemetry.org/

Full metadata record

DC FieldValue Language
dc.language.isoen_USen
dc.titleMicroprocessor Controlled Thick-Film PCM Telemetry Systemen_US
dc.contributor.authorHakimoglu, Demirhanen
dc.contributor.departmentAydin Vector Divisionen
dc.date.issued1975-10en
dc.rightsCopyright © International Foundation for Telemeteringen
dc.description.collectioninformationProceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.en
dc.publisherInternational Foundation for Telemeteringen
dc.description.abstractThis paper describes an approach to airborne PCM data acquisition that takes advantage of the latest technological advances in the fields of both the monolithic microcircuits and hybrid packaging. The result is a low cost system that provides a combination of long sought-after features; flexibility, modular make-up, microminiature size, high reliability and low power.en
dc.description.sponsorshipInternational Foundation for Telemeteringen
dc.identifier.issn0884-5123en
dc.identifier.issn0074-9079en
dc.identifier.urihttp://hdl.handle.net/10150/609358en
dc.identifier.journalInternational Telemetering Conference Proceedingsen
dc.typetexten
dc.typeProceedingsen
dc.relation.urlhttp://www.telemetry.org/en
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