Persistent Link:
http://hdl.handle.net/10150/608736
Title:
CUSTOMIZABLE MULTICHIP MODULES FOR HIGH-G TELEMETRY APPLICATIONS
Author:
Muller, Peter; Burke, Larry; Sommerfeldt, Scott; Lunceford, Brent; Francomacaro, Shaun; Lehtonen, S. John
Affiliation:
Army Research Laboratory; Microelectronics and Computer Technology Corporation; Johns Hopkins University
Issue Date:
1999-10
Rights:
Copyright © International Foundation for Telemetering
Collection Information:
Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.
Publisher:
International Foundation for Telemetering
Journal:
International Telemetering Conference Proceedings
Abstract:
The Microelectronics and Computer Technology Corporation (MCC) has developed a rapid turn around process for fabricating multichip modules (MCM’s) called the Flexible Manufacturing of MCM’s (FMM). The Army Research Lab (ARL) in co-operation with the Applied Physics Laboratory (APL), has investigated the survivability of this technology in high-g applications. Comparisons were made to other packaging technologies by constructing a 3-channel digital recorder in this and two other competing technologies.
Keywords:
Telemetry; multichip modules; copper-polyimide; high-g; digital recorder; in-bore
Sponsors:
International Foundation for Telemetering
ISSN:
0884-5123; 0074-9079
Additional Links:
http://www.telemetry.org/

Full metadata record

DC FieldValue Language
dc.language.isoen_USen
dc.titleCUSTOMIZABLE MULTICHIP MODULES FOR HIGH-G TELEMETRY APPLICATIONSen_US
dc.contributor.authorMuller, Peteren
dc.contributor.authorBurke, Larryen
dc.contributor.authorSommerfeldt, Scotten
dc.contributor.authorLunceford, Brenten
dc.contributor.authorFrancomacaro, Shaunen
dc.contributor.authorLehtonen, S. Johnen
dc.contributor.departmentArmy Research Laboratoryen
dc.contributor.departmentMicroelectronics and Computer Technology Corporationen
dc.contributor.departmentJohns Hopkins Universityen
dc.date.issued1999-10en
dc.rightsCopyright © International Foundation for Telemeteringen
dc.description.collectioninformationProceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.en
dc.publisherInternational Foundation for Telemeteringen
dc.description.abstractThe Microelectronics and Computer Technology Corporation (MCC) has developed a rapid turn around process for fabricating multichip modules (MCM’s) called the Flexible Manufacturing of MCM’s (FMM). The Army Research Lab (ARL) in co-operation with the Applied Physics Laboratory (APL), has investigated the survivability of this technology in high-g applications. Comparisons were made to other packaging technologies by constructing a 3-channel digital recorder in this and two other competing technologies.en
dc.subjectTelemetryen
dc.subjectmultichip modulesen
dc.subjectcopper-polyimideen
dc.subjecthigh-gen
dc.subjectdigital recorderen
dc.subjectin-boreen
dc.description.sponsorshipInternational Foundation for Telemeteringen
dc.identifier.issn0884-5123en
dc.identifier.issn0074-9079en
dc.identifier.urihttp://hdl.handle.net/10150/608736en
dc.identifier.journalInternational Telemetering Conference Proceedingsen
dc.typetexten
dc.typeProceedingsen
dc.relation.urlhttp://www.telemetry.org/en
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