Persistent Link:
http://hdl.handle.net/10150/608389
Title:
THE CHALLENGE OF REENGINEERING IN THE FABRICATION OF FLIGHT ELECTRONICS
Author:
de Silveira, Carl
Affiliation:
California Institute of Technology
Issue Date:
1996-10
Rights:
Copyright © International Foundation for Telemetering
Collection Information:
Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.
Publisher:
International Foundation for Telemetering
Journal:
International Telemetering Conference Proceedings
Abstract:
As we adopt and implement the doctrines of reengineering, we at NASA/Jet Propulsion Laboratory (JPL) are asked to make a giant leap in how we think of and design SpaceCraft. We call what we are doing a revolution, since we are not “evolving” to the next step in our activity, but literally leaping beyond it. This is fully in concert with the concepts of reengineering, in that areas that need to be changed are indeed literally invented anew. To be successful, JPL and its industry partners, must perfect processes, techniques and methods that allow them to work together at all levels of the SpaceCraft development cycle. If all other parts of the discipline have moved on and changed, but a key portion remains locked in a time warp of yesterday, we will not be able to reach our desired goal. At the present time change is occurring all over JPL, and it is our intent to describe how it applies to areas where prototype, or one of a kind hardware are fabricated, and how these areas might look when new approaches to doing business are applied. Since all activities in an organization must attain similar levels of expertise or be in danger of hampering the entire process, the issues of Packaging Engineering, Manufactureability, and fabrication become key items.
Keywords:
Flight Electronics; Electronics Fabrication; Reengineering; fabrication processes; Packaging Engineering; Manufacturing Engineering; JPL processes
Sponsors:
International Foundation for Telemetering
ISSN:
0884-5123; 0074-9079
Additional Links:
http://www.telemetry.org/

Full metadata record

DC FieldValue Language
dc.language.isoen_USen
dc.titleTHE CHALLENGE OF REENGINEERING IN THE FABRICATION OF FLIGHT ELECTRONICSen_US
dc.contributor.authorde Silveira, Carlen
dc.contributor.departmentCalifornia Institute of Technologyen
dc.date.issued1996-10en
dc.rightsCopyright © International Foundation for Telemeteringen
dc.description.collectioninformationProceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.en
dc.publisherInternational Foundation for Telemeteringen
dc.description.abstractAs we adopt and implement the doctrines of reengineering, we at NASA/Jet Propulsion Laboratory (JPL) are asked to make a giant leap in how we think of and design SpaceCraft. We call what we are doing a revolution, since we are not “evolving” to the next step in our activity, but literally leaping beyond it. This is fully in concert with the concepts of reengineering, in that areas that need to be changed are indeed literally invented anew. To be successful, JPL and its industry partners, must perfect processes, techniques and methods that allow them to work together at all levels of the SpaceCraft development cycle. If all other parts of the discipline have moved on and changed, but a key portion remains locked in a time warp of yesterday, we will not be able to reach our desired goal. At the present time change is occurring all over JPL, and it is our intent to describe how it applies to areas where prototype, or one of a kind hardware are fabricated, and how these areas might look when new approaches to doing business are applied. Since all activities in an organization must attain similar levels of expertise or be in danger of hampering the entire process, the issues of Packaging Engineering, Manufactureability, and fabrication become key items.en
dc.subjectFlight Electronicsen
dc.subjectElectronics Fabricationen
dc.subjectReengineeringen
dc.subjectfabrication processesen
dc.subjectPackaging Engineeringen
dc.subjectManufacturing Engineeringen
dc.subjectJPL processesen
dc.description.sponsorshipInternational Foundation for Telemeteringen
dc.identifier.issn0884-5123en
dc.identifier.issn0074-9079en
dc.identifier.urihttp://hdl.handle.net/10150/608389en
dc.identifier.journalInternational Telemetering Conference Proceedingsen
dc.typetexten
dc.typeProceedingsen
dc.relation.urlhttp://www.telemetry.org/en
All Items in UA Campus Repository are protected by copyright, with all rights reserved, unless otherwise indicated.