Persistent Link:
http://hdl.handle.net/10150/605043
Title:
Common Electrical Block CMOS-Based MEMS Sensors for Embedded Instrumentation
Author:
D’Amico, William; Rebello, Keith J.; Park, Rudolph V.; Fedder, Gary K.
Affiliation:
The Johns Hopkins University Applied Physics Laboratory; Carnegie Mellon University
Issue Date:
2005-10
Rights:
Copyright © International Foundation for Telemetering
Collection Information:
Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.
Publisher:
International Foundation for Telemetering
Journal:
International Telemetering Conference Proceedings
Abstract:
As the need for embedded instrumentation (EI) grows in the military community, unique telemetry and sensor suites will be required. The typical path for combining sensors and telemetry is to select the packaged sensors for the required measurements and then to configure a separately packaged telemetry device. Today since die level telemetry systems are emerging, it should be considered that sensor suites are integrated at the die level with the telemetry components into a miniature and low power EI system.
Sponsors:
International Foundation for Telemetering
ISSN:
0884-5123; 0074-9079
Additional Links:
http://www.telemetry.org/

Full metadata record

DC FieldValue Language
dc.language.isoen_USen
dc.titleCommon Electrical Block CMOS-Based MEMS Sensors for Embedded Instrumentationen_US
dc.contributor.authorD’Amico, Williamen
dc.contributor.authorRebello, Keith J.en
dc.contributor.authorPark, Rudolph V.en
dc.contributor.authorFedder, Gary K.en
dc.contributor.departmentThe Johns Hopkins University Applied Physics Laboratoryen
dc.contributor.departmentCarnegie Mellon Universityen
dc.date.issued2005-10en
dc.rightsCopyright © International Foundation for Telemeteringen
dc.description.collectioninformationProceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.en
dc.publisherInternational Foundation for Telemeteringen
dc.description.abstractAs the need for embedded instrumentation (EI) grows in the military community, unique telemetry and sensor suites will be required. The typical path for combining sensors and telemetry is to select the packaged sensors for the required measurements and then to configure a separately packaged telemetry device. Today since die level telemetry systems are emerging, it should be considered that sensor suites are integrated at the die level with the telemetry components into a miniature and low power EI system.en
dc.description.sponsorshipInternational Foundation for Telemeteringen
dc.identifier.issn0884-5123en
dc.identifier.issn0074-9079en
dc.identifier.urihttp://hdl.handle.net/10150/605043en
dc.identifier.journalInternational Telemetering Conference Proceedingsen
dc.typetexten
dc.typeProceedingsen
dc.relation.urlhttp://www.telemetry.org/en
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