APTMC: AN INTERFACE PROGRAM FOR USE WITH ANSYS FOR THERMAL AND THERMALLY INDUCED STRESS MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING

Persistent Link:
http://hdl.handle.net/10150/291399
Title:
APTMC: AN INTERFACE PROGRAM FOR USE WITH ANSYS FOR THERMAL AND THERMALLY INDUCED STRESS MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING
Author:
Shiang, Jyue-Jon, 1956-
Issue Date:
1987
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
ANSYS Packaging Thermal/Mechanical Calculator (APTMC) is an interface program developed for use with ANSYS and specially designed to handle thermal and thermally induced stress modeling/simulation of Level 1 and Level 2 VLSI packaging structures and assemblies. APTMC is written in PASCAL and operates in an interactive I/O format mode. This user-friendly tool leads an analyst/designer through the process of creating appropriate thermal and thermally induced stress models and other operations necessary to run ANSYS. It includes such steps as the following: (1) construction of ANSYS commands through the string process; (2) creation of a dynamic data structure which expands and contracts during program execution based on the data storage requirements of the program sets to control model generation; (3) access of material data and model parameters from the developed INTERNAL DATABANK which contains: (a) material data list; (b) heat transfer modes; and (c) library of structures; (4) forming ANSYS PREP7 and POSTn command files. (Abstract shortened with permission of author.)
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Semiconductors -- Packaging -- Testing.; Integrated circuits -- Very large scale integration -- Packaging.; ANSYS (Computer system)
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College; Electrical and Computer Engineering
Degree Grantor:
University of Arizona
Advisor:
Prince, John L.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleAPTMC: AN INTERFACE PROGRAM FOR USE WITH ANSYS FOR THERMAL AND THERMALLY INDUCED STRESS MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGINGen_US
dc.creatorShiang, Jyue-Jon, 1956-en_US
dc.contributor.authorShiang, Jyue-Jon, 1956-en_US
dc.date.issued1987en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractANSYS Packaging Thermal/Mechanical Calculator (APTMC) is an interface program developed for use with ANSYS and specially designed to handle thermal and thermally induced stress modeling/simulation of Level 1 and Level 2 VLSI packaging structures and assemblies. APTMC is written in PASCAL and operates in an interactive I/O format mode. This user-friendly tool leads an analyst/designer through the process of creating appropriate thermal and thermally induced stress models and other operations necessary to run ANSYS. It includes such steps as the following: (1) construction of ANSYS commands through the string process; (2) creation of a dynamic data structure which expands and contracts during program execution based on the data storage requirements of the program sets to control model generation; (3) access of material data and model parameters from the developed INTERNAL DATABANK which contains: (a) material data list; (b) heat transfer modes; and (c) library of structures; (4) forming ANSYS PREP7 and POSTn command files. (Abstract shortened with permission of author.)en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectSemiconductors -- Packaging -- Testing.en_US
dc.subjectIntegrated circuits -- Very large scale integration -- Packaging.en_US
dc.subjectANSYS (Computer system)en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorPrince, John L.en_US
dc.identifier.proquest1330539en_US
dc.identifier.oclc17433122en_US
dc.identifier.bibrecord.b1629516xen_US
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