Constitutive modeling of joining materials in electronic packaging

Persistent Link:
http://hdl.handle.net/10150/280470
Title:
Constitutive modeling of joining materials in electronic packaging
Author:
Dube, Manu
Issue Date:
2004
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
Modeling simplifications for complex material behavior may lead to unanticipated errors under generalized loading conditions, which are difficult to detect in finite element analyses. This work analyzes existing models under simple loading conditions where the nature of the results is known a priori, and proposes new models to overcome the limitations detected. Elastic and elastoplastic formulations for loading-dependent material parameters are generalized, and limitations of the rate-dependent elastoplastic simulation and the Perzyna viscoplastic formulation are discussed. A yield function that provides continuous yielding irrespective of the direction of loading and does not generate spurious plastic strain increments under temperature change is developed. A thermomechanical model based on the concept of superposition of asymptotic phases is also proposed, with generalized stress-strain-temperature relationships that intrinsically predict the variation of the coefficient of thermal expansion and elastic constants with temperature, and is validated for aluminum, lead, tin and solder. A plastic yield criterion shown to be in general agreement with hardening based on dislocation density and a preliminary empirical creep equation for lead-tin eutectic solder are developed as part of the thermomechanical model. Finally an approximate dissipated-work based formulation for the Disturbed State Concept of Desai (2001) is developed and limitations of DSC assumptions are discussed. Validations are conducted for the eutectic lead-tin data of Wang et al. (2001), with prior parameters being shown to require recomputation.
Type:
text; Dissertation-Reproduction (electronic)
Keywords:
Applied Mechanics.; Engineering, Electronics and Electrical.; Engineering, Mechanical.
Degree Name:
Ph.D.
Degree Level:
doctoral
Degree Program:
Graduate College; Civil Engineering and Engineering Mechanics
Degree Grantor:
University of Arizona
Advisor:
Kundu, Tribikram

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleConstitutive modeling of joining materials in electronic packagingen_US
dc.creatorDube, Manuen_US
dc.contributor.authorDube, Manuen_US
dc.date.issued2004en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractModeling simplifications for complex material behavior may lead to unanticipated errors under generalized loading conditions, which are difficult to detect in finite element analyses. This work analyzes existing models under simple loading conditions where the nature of the results is known a priori, and proposes new models to overcome the limitations detected. Elastic and elastoplastic formulations for loading-dependent material parameters are generalized, and limitations of the rate-dependent elastoplastic simulation and the Perzyna viscoplastic formulation are discussed. A yield function that provides continuous yielding irrespective of the direction of loading and does not generate spurious plastic strain increments under temperature change is developed. A thermomechanical model based on the concept of superposition of asymptotic phases is also proposed, with generalized stress-strain-temperature relationships that intrinsically predict the variation of the coefficient of thermal expansion and elastic constants with temperature, and is validated for aluminum, lead, tin and solder. A plastic yield criterion shown to be in general agreement with hardening based on dislocation density and a preliminary empirical creep equation for lead-tin eutectic solder are developed as part of the thermomechanical model. Finally an approximate dissipated-work based formulation for the Disturbed State Concept of Desai (2001) is developed and limitations of DSC assumptions are discussed. Validations are conducted for the eutectic lead-tin data of Wang et al. (2001), with prior parameters being shown to require recomputation.en_US
dc.typetexten_US
dc.typeDissertation-Reproduction (electronic)en_US
dc.subjectApplied Mechanics.en_US
dc.subjectEngineering, Electronics and Electrical.en_US
dc.subjectEngineering, Mechanical.en_US
thesis.degree.namePh.D.en_US
thesis.degree.leveldoctoralen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineCivil Engineering and Engineering Mechanicsen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorKundu, Tribikramen_US
dc.identifier.proquest3119941en_US
dc.identifier.bibrecord.b45629316en_US
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