Persistent Link:
http://hdl.handle.net/10150/280238
Title:
Coupled thermal and vibration numerical analysis of solder joints
Author:
Nickerson, Mark David
Issue Date:
2002
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
A heat transfer subroutine has been implemented into an existing finite element code developed in theCivil Engineering and Engineering Mechanics Department at the University of Arizona by Dr. Desai and students. The code is capable of performing non linear material and dynamic analysis. The heat transfer subroutine has been implemented such that any inelastic material behavior induced by a temperature increment is captured at every time step in a loading cycle. With the addition of the heat transfer routine, both thermal sources and sinks can be modeled. For example, power generating chips and power dissipating heat sinks, respectively. This will allow a more realistic representation of electronic packages under operational conditions. A 313 ball PBGA staggered area array package was used in all the analyses performed in this dissertation. The calibration of the models was based on research performed by the JPL consortium which included members such as Raytheon, Boeing and Xilinx. The focus of this dissertation was to determine the thermal and vibration fatigue lifetimes of electronic packages using the Disturbed State Concept. To achieve this goal, numerous analyses were performed, representing different test cases. The different test cases included thermal test chamber cycling (TCT), power cycling (PCT), vibration, thermal test chamber cycling with voids in solder balls, vibration with voids in solder balls, and coupled temperature with vibration. Based on the results of these analyses, the Disturbed State Concept was found to predict the fatigue lifetimes of the 313 PBGA package with excellent accuracy, when test results were available for comparison.
Type:
text; Dissertation-Reproduction (electronic)
Keywords:
Engineering, Mechanical.
Degree Name:
Ph.D.
Degree Level:
doctoral
Degree Program:
Graduate College; Civil Engineering and Engineering Mechanics
Degree Grantor:
University of Arizona
Advisor:
Desai, Chandrakant S.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleCoupled thermal and vibration numerical analysis of solder jointsen_US
dc.creatorNickerson, Mark Daviden_US
dc.contributor.authorNickerson, Mark Daviden_US
dc.date.issued2002en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractA heat transfer subroutine has been implemented into an existing finite element code developed in theCivil Engineering and Engineering Mechanics Department at the University of Arizona by Dr. Desai and students. The code is capable of performing non linear material and dynamic analysis. The heat transfer subroutine has been implemented such that any inelastic material behavior induced by a temperature increment is captured at every time step in a loading cycle. With the addition of the heat transfer routine, both thermal sources and sinks can be modeled. For example, power generating chips and power dissipating heat sinks, respectively. This will allow a more realistic representation of electronic packages under operational conditions. A 313 ball PBGA staggered area array package was used in all the analyses performed in this dissertation. The calibration of the models was based on research performed by the JPL consortium which included members such as Raytheon, Boeing and Xilinx. The focus of this dissertation was to determine the thermal and vibration fatigue lifetimes of electronic packages using the Disturbed State Concept. To achieve this goal, numerous analyses were performed, representing different test cases. The different test cases included thermal test chamber cycling (TCT), power cycling (PCT), vibration, thermal test chamber cycling with voids in solder balls, vibration with voids in solder balls, and coupled temperature with vibration. Based on the results of these analyses, the Disturbed State Concept was found to predict the fatigue lifetimes of the 313 PBGA package with excellent accuracy, when test results were available for comparison.en_US
dc.typetexten_US
dc.typeDissertation-Reproduction (electronic)en_US
dc.subjectEngineering, Mechanical.en_US
thesis.degree.namePh.D.en_US
thesis.degree.leveldoctoralen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineCivil Engineering and Engineering Mechanicsen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorDesai, Chandrakant S.en_US
dc.identifier.proquest3073288en_US
dc.identifier.bibrecord.b43473179en_US
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