Persistent Link:
http://hdl.handle.net/10150/279991
Title:
Reliability analysis considering product performance degradation
Author:
Huang, Wei
Issue Date:
2002
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
This dissertation presents a statistical model and analysis procedure for product performance aging degradation data. This model takes into account the strictly increasing/decreasing nature of performance measurements at multiple observation times. Maximum likelihood estimation (MLE) is used to estimate the time varying parameters of the proposed statistical model. The analysis of both generated data and field data is presented. To demonstrate product reliability under aging, an analysis of surface mounted solder joints due to thermal fatigue is included in the dissertation. This analysis was done by first examining published life test data and then identifying the intermetallic compound (IMC) thickness randomness. Results indicate that the IMC layer thickness randomness may have significant influence on the Mean Time To Failure (MTTF) and the reliability at high thermal cycles. The analysis of products with competing hard and soft failure modes is presented in terms of distribution independence. Derivation and examples are included for the event when the product finally fails in a specific failure mode. Finally, an improved strength-stress interference (SSI) reliability model is derived for analyzing a more general engineering degradation problem. This model incorporates both stochastic strength aging degradation and the stochastic loading force directed at the product. Statistical inference for simple stochastic processes and numerical examples are analyzed and discussed to verify the model.
Type:
text; Dissertation-Reproduction (electronic)
Keywords:
Engineering, Industrial.
Degree Name:
Ph.D.
Degree Level:
doctoral
Degree Program:
Graduate College; Systems and Industrial Engineering
Degree Grantor:
University of Arizona
Advisor:
Dietrich, Duane L.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleReliability analysis considering product performance degradationen_US
dc.creatorHuang, Weien_US
dc.contributor.authorHuang, Weien_US
dc.date.issued2002en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThis dissertation presents a statistical model and analysis procedure for product performance aging degradation data. This model takes into account the strictly increasing/decreasing nature of performance measurements at multiple observation times. Maximum likelihood estimation (MLE) is used to estimate the time varying parameters of the proposed statistical model. The analysis of both generated data and field data is presented. To demonstrate product reliability under aging, an analysis of surface mounted solder joints due to thermal fatigue is included in the dissertation. This analysis was done by first examining published life test data and then identifying the intermetallic compound (IMC) thickness randomness. Results indicate that the IMC layer thickness randomness may have significant influence on the Mean Time To Failure (MTTF) and the reliability at high thermal cycles. The analysis of products with competing hard and soft failure modes is presented in terms of distribution independence. Derivation and examples are included for the event when the product finally fails in a specific failure mode. Finally, an improved strength-stress interference (SSI) reliability model is derived for analyzing a more general engineering degradation problem. This model incorporates both stochastic strength aging degradation and the stochastic loading force directed at the product. Statistical inference for simple stochastic processes and numerical examples are analyzed and discussed to verify the model.en_US
dc.typetexten_US
dc.typeDissertation-Reproduction (electronic)en_US
dc.subjectEngineering, Industrial.en_US
thesis.degree.namePh.D.en_US
thesis.degree.leveldoctoralen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineSystems and Industrial Engineeringen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorDietrich, Duane L.en_US
dc.identifier.proquest3050366en_US
dc.identifier.bibrecord.b42729932en_US
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