Characterization and comparison of creep properties for tin-indium-silver solder joints

Persistent Link:
http://hdl.handle.net/10150/278555
Title:
Characterization and comparison of creep properties for tin-indium-silver solder joints
Author:
Seddon, Michael John, 1971-
Issue Date:
1996
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
In the search of a lead-free solder for use as a replacement of the current tin/lead solders, an alloy consisting of 77.2% tin, 20% indium, and 2.8% silver has been invented. This solder, entitled Indalloy #227, has demonstrated bulk properties comparable to tin/lead solders. Further characterization of this alloy was completed in this research by determining the steady state creep rate properties of actual solder joints. The solder joints were formed using ceramic substrates with gold/nickel/copper and copper pad metallizations. The fabrication process of the samples was optimized to yield the highest shear strength. Creep properties were determined at temperatures ranging from -40°C to 125°C using a set of grips which subjected the samples to pure shear stresses. The activation energy was determined, and a comparison of the creep rates was then made to five other solders. Results from this comparison showed that the 77.2Sn/20.0In/2.8Ag solder demonstrates creep properties similar to those of typical tin/lead solders.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Engineering, Electronics and Electrical.; Engineering, Materials Science.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College; Materials Science and Engineering
Degree Grantor:
University of Arizona
Advisor:
Jackson, Kenneth A.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleCharacterization and comparison of creep properties for tin-indium-silver solder jointsen_US
dc.creatorSeddon, Michael John, 1971-en_US
dc.contributor.authorSeddon, Michael John, 1971-en_US
dc.date.issued1996en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractIn the search of a lead-free solder for use as a replacement of the current tin/lead solders, an alloy consisting of 77.2% tin, 20% indium, and 2.8% silver has been invented. This solder, entitled Indalloy #227, has demonstrated bulk properties comparable to tin/lead solders. Further characterization of this alloy was completed in this research by determining the steady state creep rate properties of actual solder joints. The solder joints were formed using ceramic substrates with gold/nickel/copper and copper pad metallizations. The fabrication process of the samples was optimized to yield the highest shear strength. Creep properties were determined at temperatures ranging from -40°C to 125°C using a set of grips which subjected the samples to pure shear stresses. The activation energy was determined, and a comparison of the creep rates was then made to five other solders. Results from this comparison showed that the 77.2Sn/20.0In/2.8Ag solder demonstrates creep properties similar to those of typical tin/lead solders.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectEngineering, Electronics and Electrical.en_US
dc.subjectEngineering, Materials Science.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineMaterials Science and Engineeringen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorJackson, Kenneth A.en_US
dc.identifier.proquest1381945en_US
dc.identifier.bibrecord.b34294168en_US
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