Finite-difference time-domain analysis of complex interconnect structures

Persistent Link:
http://hdl.handle.net/10150/278326
Title:
Finite-difference time-domain analysis of complex interconnect structures
Author:
Gribbons, Michael Alan, 1967-
Issue Date:
1993
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
This thesis considers the application of the finite-difference time-domain (FD-TD) method to the electromagnetic characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes. The limitations of the method in finding the propagation characteristics, characteristic impedance, Z0, and phase constant, beta, are investigated. A different method for the characterization of MCM interconnects is suggested which exploits the capabilities of the FDTD method. This alternative approach uses the results from the FDTD method to extract a per unit length delay and an approximate impulse response of the system. These results can be used to identify the effects of the perforated reference plane on signal propagation. In particular the validity of the TEM approximation for signal propagation in realistic MCM structures is examined. For those cases where the TEM approximation is valid, a quasi-TEM approach is developed to find equivalent transmission line characteristics of MCM interconnects. This quasi-TEM method can be used to obtain effective transmission line parameters for both single and coupled interconnects, which in turn can be used directly in SPICE-like waveform simulation tools for an overall electrical analysis of complex MCM interconnect nets.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Engineering, Electronics and Electrical.; Engineering, Packaging.; Computer Science.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College
Degree Grantor:
University of Arizona
Advisor:
Cangellaris, Andreas C.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleFinite-difference time-domain analysis of complex interconnect structuresen_US
dc.creatorGribbons, Michael Alan, 1967-en_US
dc.contributor.authorGribbons, Michael Alan, 1967-en_US
dc.date.issued1993en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThis thesis considers the application of the finite-difference time-domain (FD-TD) method to the electromagnetic characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes. The limitations of the method in finding the propagation characteristics, characteristic impedance, Z0, and phase constant, beta, are investigated. A different method for the characterization of MCM interconnects is suggested which exploits the capabilities of the FDTD method. This alternative approach uses the results from the FDTD method to extract a per unit length delay and an approximate impulse response of the system. These results can be used to identify the effects of the perforated reference plane on signal propagation. In particular the validity of the TEM approximation for signal propagation in realistic MCM structures is examined. For those cases where the TEM approximation is valid, a quasi-TEM approach is developed to find equivalent transmission line characteristics of MCM interconnects. This quasi-TEM method can be used to obtain effective transmission line parameters for both single and coupled interconnects, which in turn can be used directly in SPICE-like waveform simulation tools for an overall electrical analysis of complex MCM interconnect nets.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectEngineering, Electronics and Electrical.en_US
dc.subjectEngineering, Packaging.en_US
dc.subjectComputer Science.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorCangellaris, Andreas C.en_US
dc.identifier.proquest1353093en_US
dc.identifier.bibrecord.b27587897en_US
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