The electrical properties and reliability of solder bump interconnections

Persistent Link:
http://hdl.handle.net/10150/278310
Title:
The electrical properties and reliability of solder bump interconnections
Author:
Sarnack-Alley, William Joseph, 1954-
Issue Date:
1993
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
The electrical properties (resistance, capacitance, and inductance) of spherical solder bumps are computed. The solder bump is modeled using a finite, lossless transmission line model. The resistive, capacitive, and inductive effects are calculated separately then combined using superposition. The transmission line impedance for a 300 μm solder bump is calculated and the effect on a 100 nsec rise time signal is computed. Several methods to calculate fatigue lifetime are examined then related to reliability and design parameters. Methods to improve reliability are examined and their impact on electrical performance discussed.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Engineering, Electronics and Electrical.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College
Degree Grantor:
University of Arizona
Advisor:
Palusinski, Olgierd A.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleThe electrical properties and reliability of solder bump interconnectionsen_US
dc.creatorSarnack-Alley, William Joseph, 1954-en_US
dc.contributor.authorSarnack-Alley, William Joseph, 1954-en_US
dc.date.issued1993en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThe electrical properties (resistance, capacitance, and inductance) of spherical solder bumps are computed. The solder bump is modeled using a finite, lossless transmission line model. The resistive, capacitive, and inductive effects are calculated separately then combined using superposition. The transmission line impedance for a 300 μm solder bump is calculated and the effect on a 100 nsec rise time signal is computed. Several methods to calculate fatigue lifetime are examined then related to reliability and design parameters. Methods to improve reliability are examined and their impact on electrical performance discussed.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectEngineering, Electronics and Electrical.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorPalusinski, Olgierd A.en_US
dc.identifier.proquest1352374en_US
dc.identifier.bibrecord.b27054913en_US
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