Persistent Link:
http://hdl.handle.net/10150/278279
Title:
The oxidation of copper and silver plated copper lead frames
Author:
Westlake, Michael Angelo, 1966-
Issue Date:
1993
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
The effects of thin silver films (15-210 angstroms) on the oxidation of copper alloy lead frames has been characterized. Silver films were deposited onto copper lead frames by immersion plating in a bath containing potassium silver cyanide, potassium cyanide, and a mercaptan inhibitor. The thickness of films was measured by microfocus x-ray fluorescence and cross-checked by Rutherford backscattering spectrometry. Lead frames coated with silver films were oxidized at 150 to 200°C in a controlled humidity oven. The amount of oxide formed was measured by an electrolytic reduction technique and cross-checked with weight gain measurements. Auger, ESCA, and SEM analysis were also performed on the films. A tape test was performed to obtain qualitative information on the adhesion of the films.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Engineering, Chemical.; Engineering, Metallurgy.; Engineering, Materials Science.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College
Degree Grantor:
University of Arizona
Advisor:
Raghavan, Srini

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleThe oxidation of copper and silver plated copper lead framesen_US
dc.creatorWestlake, Michael Angelo, 1966-en_US
dc.contributor.authorWestlake, Michael Angelo, 1966-en_US
dc.date.issued1993en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThe effects of thin silver films (15-210 angstroms) on the oxidation of copper alloy lead frames has been characterized. Silver films were deposited onto copper lead frames by immersion plating in a bath containing potassium silver cyanide, potassium cyanide, and a mercaptan inhibitor. The thickness of films was measured by microfocus x-ray fluorescence and cross-checked by Rutherford backscattering spectrometry. Lead frames coated with silver films were oxidized at 150 to 200°C in a controlled humidity oven. The amount of oxide formed was measured by an electrolytic reduction technique and cross-checked with weight gain measurements. Auger, ESCA, and SEM analysis were also performed on the films. A tape test was performed to obtain qualitative information on the adhesion of the films.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectEngineering, Chemical.en_US
dc.subjectEngineering, Metallurgy.en_US
dc.subjectEngineering, Materials Science.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorRaghavan, Srinien_US
dc.identifier.proquest1352320en_US
dc.identifier.bibrecord.b27030088en_US
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