Overshoot controlled interconnection design for multichip modules (MCM's)

Persistent Link:
http://hdl.handle.net/10150/278048
Title:
Overshoot controlled interconnection design for multichip modules (MCM's)
Author:
Mi, Wei, 1960-
Issue Date:
1991
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
The arrival of high-speed, large-area IC's forces development of packages with high-density, small cross-sectional wiring. This trend is particularly clear for packages housing many chips (MCM's). It is shown how electrical, thermal, and fabricational constraints control line geometry in MCM's forcing the use of lossy lines. To obtain high speeds with these lossy lines, a generalized impedance-matched design is to combine load, line, and driver for overshoot-controlled performance. Using overshoot control, tradeoffs among power, area, and performance are derived for low-impedance buffers and drivers useful for lossy lines in MCM's.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Engineering, Electronics and Electrical.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College
Degree Grantor:
University of Arizona
Advisor:
Brews, John R.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleOvershoot controlled interconnection design for multichip modules (MCM's)en_US
dc.creatorMi, Wei, 1960-en_US
dc.contributor.authorMi, Wei, 1960-en_US
dc.date.issued1991en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThe arrival of high-speed, large-area IC's forces development of packages with high-density, small cross-sectional wiring. This trend is particularly clear for packages housing many chips (MCM's). It is shown how electrical, thermal, and fabricational constraints control line geometry in MCM's forcing the use of lossy lines. To obtain high speeds with these lossy lines, a generalized impedance-matched design is to combine load, line, and driver for overshoot-controlled performance. Using overshoot control, tradeoffs among power, area, and performance are derived for low-impedance buffers and drivers useful for lossy lines in MCM's.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectEngineering, Electronics and Electrical.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorBrews, John R.en_US
dc.identifier.proquest1346718en_US
dc.identifier.bibrecord.b27252759en_US
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