Persistent Link:
http://hdl.handle.net/10150/277931
Title:
The behavior of impurities during copper electrodeposition
Author:
Maeda, Yoshitsugu, 1957-
Issue Date:
1991
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
The behavior of impurities (in particular arsenic, antimony and bismuth) on copper electrodeposition was investigated using several non-steady state techniques at a temperature of 63°C in cupric sulfate solution (Cu 45 g/l, H₂SO₄ 200 g/l). As a result, group-V elements work as depolarizers against copper deposition and hydrogen evolution. From the result of cyclic voltammetry, copper reduction was subject to an irreversible reaction with a preceding chemical reaction. In general, copper deposition is not significantly effected by group-V impurities at the compositions investigated. Basic electrochemical parameters, except for the transfer coefficient, were also insensitive to these impurity constituents. However, there is a peak due to arsenic reduction (at -0.330 V) in cyclic voltammogram for the As-containing electrolyte. In addition, the effect of impurities on morphologies were investigated by SEM observation and X-ray diffractometry. As a result, group-V promoted truncated deposits and the (110) crystallographic orientation.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Engineering, Materials Science.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College
Degree Grantor:
University of Arizona
Advisor:
Hiskey, J. Brent

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleThe behavior of impurities during copper electrodepositionen_US
dc.creatorMaeda, Yoshitsugu, 1957-en_US
dc.contributor.authorMaeda, Yoshitsugu, 1957-en_US
dc.date.issued1991en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThe behavior of impurities (in particular arsenic, antimony and bismuth) on copper electrodeposition was investigated using several non-steady state techniques at a temperature of 63°C in cupric sulfate solution (Cu 45 g/l, H₂SO₄ 200 g/l). As a result, group-V elements work as depolarizers against copper deposition and hydrogen evolution. From the result of cyclic voltammetry, copper reduction was subject to an irreversible reaction with a preceding chemical reaction. In general, copper deposition is not significantly effected by group-V impurities at the compositions investigated. Basic electrochemical parameters, except for the transfer coefficient, were also insensitive to these impurity constituents. However, there is a peak due to arsenic reduction (at -0.330 V) in cyclic voltammogram for the As-containing electrolyte. In addition, the effect of impurities on morphologies were investigated by SEM observation and X-ray diffractometry. As a result, group-V promoted truncated deposits and the (110) crystallographic orientation.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectEngineering, Materials Science.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorHiskey, J. Brenten_US
dc.identifier.proquest1345387en_US
dc.identifier.bibrecord.b27003589en_US
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