Persistent Link:
http://hdl.handle.net/10150/277898
Title:
Aluminoborophosphosilicate glasses for microelectronics packaging
Author:
Zubair, Muhammed, 1962-
Issue Date:
1991
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
Glasses are used in microelectronic packaging for insulation and passivation purposes. To optimize the performance of these packages, it is necessary to investigate new glasses or improve on properties of the glasses in use. The insulating glass should have low dielectric constant, low dissipation factor, low glass transition temperature, high chemical resistivity, and a thermal expansion coefficient matching the substrate. In this study, various aluminoborophosphosilicate glasses containing Ca(Mg)O, Ca(Mg)F₂, and AlF₃ as flux were investigated. Processing temperatures for these glasses range from 1300°C to 1500°C. The coefficients of thermal expansion range from 4.52 μ/°C to 9.39 μ/°C. The dielectric constant as a function of frequency and composition is in the range of 4.1 to 5.2. The index of refraction for these glasses is in the range of 1.52 to 1.58. Glass transition and softening temperatures as low as 538°C and 622°C, respective, were found. Results of this investigation are discussed in terms of the possible use of aluminoborophosphosilicate glasses in microelectronic packaging.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Chemistry, Inorganic.; Engineering, Electronics and Electrical.; Engineering, Materials Science.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College
Degree Grantor:
University of Arizona
Advisor:
Zelinski, Brian J. J.; Schrimpf, Ronald D.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleAluminoborophosphosilicate glasses for microelectronics packagingen_US
dc.creatorZubair, Muhammed, 1962-en_US
dc.contributor.authorZubair, Muhammed, 1962-en_US
dc.date.issued1991en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractGlasses are used in microelectronic packaging for insulation and passivation purposes. To optimize the performance of these packages, it is necessary to investigate new glasses or improve on properties of the glasses in use. The insulating glass should have low dielectric constant, low dissipation factor, low glass transition temperature, high chemical resistivity, and a thermal expansion coefficient matching the substrate. In this study, various aluminoborophosphosilicate glasses containing Ca(Mg)O, Ca(Mg)F₂, and AlF₃ as flux were investigated. Processing temperatures for these glasses range from 1300°C to 1500°C. The coefficients of thermal expansion range from 4.52 μ/°C to 9.39 μ/°C. The dielectric constant as a function of frequency and composition is in the range of 4.1 to 5.2. The index of refraction for these glasses is in the range of 1.52 to 1.58. Glass transition and softening temperatures as low as 538°C and 622°C, respective, were found. Results of this investigation are discussed in terms of the possible use of aluminoborophosphosilicate glasses in microelectronic packaging.en_US
dc.description.noteDigitization note: p. 59-60 missing in paper original and microfilm version; appears to be pagination error.-
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectChemistry, Inorganic.en_US
dc.subjectEngineering, Electronics and Electrical.en_US
dc.subjectEngineering, Materials Science.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorZelinski, Brian J. J.en_US
dc.contributor.advisorSchrimpf, Ronald D.en_US
dc.identifier.proquest1343853en_US
dc.identifier.bibrecord.b26874490en_US
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