Effects of downset and die coat on stress sensitivity in a 16-pin molded plastic DIP

Persistent Link:
http://hdl.handle.net/10150/277001
Title:
Effects of downset and die coat on stress sensitivity in a 16-pin molded plastic DIP
Author:
Paugh, Michael Ernest, 1954-
Issue Date:
1989
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
Stress sensitivity of a 16 - bit D/A converter in a molded plastic DIP has been studied. Device performance was shown to change as a function of package stress. The effects of die position in the package and the presence or absence of die coat on package stress and device performance were determined. Finite element methods were employed for system analysis. Device stress sensitivity was attributed to diffused bit transistors and the mechanism assigned to nonuniformity of stress on the device bit transistors. Die coat (silicone gel) was shown to reduce normal and shear stresses and have little or no effect on X-axial stresses. Lowering the die in the package was shown to increase the X-axial stress uniformity from the die center to edge for die-coated parts and alter the value of shear stresses near the die edge for parts without die coat.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Electronic apparatus and appliances -- Plastic embedment -- Research.; Electronic packaging -- Research.; Strains and stresses -- Measurement.; Digital-to-analog converters.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College; Materials Science and Engineering
Degree Grantor:
University of Arizona
Advisor:
Demer, Louis J.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleEffects of downset and die coat on stress sensitivity in a 16-pin molded plastic DIPen_US
dc.creatorPaugh, Michael Ernest, 1954-en_US
dc.contributor.authorPaugh, Michael Ernest, 1954-en_US
dc.date.issued1989en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractStress sensitivity of a 16 - bit D/A converter in a molded plastic DIP has been studied. Device performance was shown to change as a function of package stress. The effects of die position in the package and the presence or absence of die coat on package stress and device performance were determined. Finite element methods were employed for system analysis. Device stress sensitivity was attributed to diffused bit transistors and the mechanism assigned to nonuniformity of stress on the device bit transistors. Die coat (silicone gel) was shown to reduce normal and shear stresses and have little or no effect on X-axial stresses. Lowering the die in the package was shown to increase the X-axial stress uniformity from the die center to edge for die-coated parts and alter the value of shear stresses near the die edge for parts without die coat.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectElectronic apparatus and appliances -- Plastic embedment -- Research.en_US
dc.subjectElectronic packaging -- Research.en_US
dc.subjectStrains and stresses -- Measurement.en_US
dc.subjectDigital-to-analog converters.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineMaterials Science and Engineeringen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorDemer, Louis J.en_US
dc.identifier.proquest1336708en_US
dc.identifier.oclc22519550en_US
dc.identifier.bibrecord.b17450573en_US
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