Persistent Link:
http://hdl.handle.net/10150/276686
Title:
Thermal characterization of VLSI packaging
Author:
Shope, David Allen, 1958-
Issue Date:
1988
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
With electronic packaging becoming more complex, simple hand methods to model the thermal performance of the package are insufficient. As computer aided modeling methods came into use, a test system was developed to verify the predictions produced by such modeling methods. The test system is evaluated for operation and performance. Further, the premise of this type of test (the accurate calibration of packaged temperature-sensitive-parameter devices can be done) is investigated using a series of comparative tests. From this information, causes of possible/probable errors in calibration are identified and related to the different methodologies and devices used. Finally, conclusions are presented regarding the further improvement of the test system and methodologies used in this type of testing.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Computers -- Circuits -- Thermal properties.; Integrated circuits -- Very large scale integration -- Thermal properties.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College; Electrical and Computer Engineering
Degree Grantor:
University of Arizona
Advisor:
Fahey, W. J.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleThermal characterization of VLSI packagingen_US
dc.creatorShope, David Allen, 1958-en_US
dc.contributor.authorShope, David Allen, 1958-en_US
dc.date.issued1988en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractWith electronic packaging becoming more complex, simple hand methods to model the thermal performance of the package are insufficient. As computer aided modeling methods came into use, a test system was developed to verify the predictions produced by such modeling methods. The test system is evaluated for operation and performance. Further, the premise of this type of test (the accurate calibration of packaged temperature-sensitive-parameter devices can be done) is investigated using a series of comparative tests. From this information, causes of possible/probable errors in calibration are identified and related to the different methodologies and devices used. Finally, conclusions are presented regarding the further improvement of the test system and methodologies used in this type of testing.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectComputers -- Circuits -- Thermal properties.en_US
dc.subjectIntegrated circuits -- Very large scale integration -- Thermal properties.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorFahey, W. J.en_US
dc.identifier.proquest1333263en_US
dc.identifier.oclc20697624en_US
dc.identifier.bibrecord.b17066384en_US
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