Automated radiographic inspection of through-hole electronic circuit board solder defects

Persistent Link:
http://hdl.handle.net/10150/276672
Title:
Automated radiographic inspection of through-hole electronic circuit board solder defects
Author:
Leal, James Andrew, 1963-
Issue Date:
1988
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
A study has been carried out to investigate the use of "real-time" radiography as a method of automated inspection of through-hole electronic circuit board solder joints. By evaluating five major solder defects it has been found that film radiography employing high contrast film results in a definite distinction between a good solder joint and a defective solder joint. The same five defects were also found to be distinguishable from a good solder joint when evaluated by a real-time radiographic inspection unit using digital image processing. Although the type of defect being investigated was not discernible, the ability to distinguish a good solder joint from a defective solder joint is a major step in the implementation of automated solder joint inspection for military electronics.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Printed circuits industry -- Quality control.; Radiography, Industrial.; Electronic circuits -- Testing.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College; Materials Sciences and Engineering
Degree Grantor:
University of Arizona
Advisor:
Demer, Louis J.

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleAutomated radiographic inspection of through-hole electronic circuit board solder defectsen_US
dc.creatorLeal, James Andrew, 1963-en_US
dc.contributor.authorLeal, James Andrew, 1963-en_US
dc.date.issued1988en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractA study has been carried out to investigate the use of "real-time" radiography as a method of automated inspection of through-hole electronic circuit board solder joints. By evaluating five major solder defects it has been found that film radiography employing high contrast film results in a definite distinction between a good solder joint and a defective solder joint. The same five defects were also found to be distinguishable from a good solder joint when evaluated by a real-time radiographic inspection unit using digital image processing. Although the type of defect being investigated was not discernible, the ability to distinguish a good solder joint from a defective solder joint is a major step in the implementation of automated solder joint inspection for military electronics.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectPrinted circuits industry -- Quality control.en_US
dc.subjectRadiography, Industrial.en_US
dc.subjectElectronic circuits -- Testing.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineMaterials Sciences and Engineeringen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorDemer, Louis J.en_US
dc.identifier.proquest1333247en_US
dc.identifier.oclc22213393en_US
dc.identifier.bibrecord.b17380157en_US
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