THE HIGH FREQUENCY AND TEMPERATURE DEPENDENCE OF DIELECTRIC PROPERTIES OF PRINTED CIRCUIT BOARD MATERIALS

Persistent Link:
http://hdl.handle.net/10150/276509
Title:
THE HIGH FREQUENCY AND TEMPERATURE DEPENDENCE OF DIELECTRIC PROPERTIES OF PRINTED CIRCUIT BOARD MATERIALS
Author:
Rasafar, Hamid, 1954-
Issue Date:
1987
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
New VLSI and VHSIC devices require increased performance from electronic packages. The major challenge that must be met in materials/process development for high complexity and high speed integrated circuits is the processing of even larger amounts of signals with low propagation delay. Hence, materials with low dielectric constant and low dissipation factor are being sought. In this investigation the dielectric properties of the most commonly used composite materials for printed circuit boards, Teflon-glass and Epoxy-glass, were measured in the frequency and temperature intervals of 100 HZ-1 GHZ and 25-260°C, respectively. From the measured results, it is concluded that Teflon-glass is more suitable for the board level packaging of high performance circuits due to its lower dielectric constant and low dissipation factor.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Integrated circuits -- Very large scale integration -- Packaging.; Dielectric heating.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College; Electrical and Computer Engineering
Degree Grantor:
University of Arizona

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleTHE HIGH FREQUENCY AND TEMPERATURE DEPENDENCE OF DIELECTRIC PROPERTIES OF PRINTED CIRCUIT BOARD MATERIALSen_US
dc.creatorRasafar, Hamid, 1954-en_US
dc.contributor.authorRasafar, Hamid, 1954-en_US
dc.date.issued1987en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractNew VLSI and VHSIC devices require increased performance from electronic packages. The major challenge that must be met in materials/process development for high complexity and high speed integrated circuits is the processing of even larger amounts of signals with low propagation delay. Hence, materials with low dielectric constant and low dissipation factor are being sought. In this investigation the dielectric properties of the most commonly used composite materials for printed circuit boards, Teflon-glass and Epoxy-glass, were measured in the frequency and temperature intervals of 100 HZ-1 GHZ and 25-260°C, respectively. From the measured results, it is concluded that Teflon-glass is more suitable for the board level packaging of high performance circuits due to its lower dielectric constant and low dissipation factor.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectIntegrated circuits -- Very large scale integration -- Packaging.en_US
dc.subjectDielectric heating.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.identifier.proquest1331466en_US
dc.identifier.oclc17682265en_US
dc.identifier.bibrecord.b16364636en_US
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