HIGH FREQUENCY DIELECTRIC PROPERTIES OF POLYIMIDES FOR MULTILAYER INTERCONNECT STRUCTURES

Persistent Link:
http://hdl.handle.net/10150/276497
Title:
HIGH FREQUENCY DIELECTRIC PROPERTIES OF POLYIMIDES FOR MULTILAYER INTERCONNECT STRUCTURES
Author:
Hinedi, Mohamad Fahd, 1964-
Issue Date:
1987
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
One of the most important electrical requirements in high performance electronic systems or high speed integrated circuits, is to process larger numbers of electrical signals at much higher speeds. Signal propagation delay must be minimized in order to maximize signal velocities. Therefore, material with low dielectric constant and low dissipation factor is being sought. In this thesis research measurements of dielectric constant and dissipation factor were performed on commercially available polyimides that are used in multilayer interconnect structures. Capacitor structures with a polyimide dielectric were measured up to a 1GHz frequency and 220°C temperature. Polyimides were concluded to be compatible for use in high performance systems such as multilayer interconnect structures.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Polyimides -- Electric properties.; Polyimides -- Thermal properties.; Dielectric measurements.; Very high speed integrated circuits -- Materials -- Electric properties.; Very high speed integrated circuits -- Materials -- Thermal properties.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College; Electrical and Computer Engineering
Degree Grantor:
University of Arizona

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleHIGH FREQUENCY DIELECTRIC PROPERTIES OF POLYIMIDES FOR MULTILAYER INTERCONNECT STRUCTURESen_US
dc.creatorHinedi, Mohamad Fahd, 1964-en_US
dc.contributor.authorHinedi, Mohamad Fahd, 1964-en_US
dc.date.issued1987en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractOne of the most important electrical requirements in high performance electronic systems or high speed integrated circuits, is to process larger numbers of electrical signals at much higher speeds. Signal propagation delay must be minimized in order to maximize signal velocities. Therefore, material with low dielectric constant and low dissipation factor is being sought. In this thesis research measurements of dielectric constant and dissipation factor were performed on commercially available polyimides that are used in multilayer interconnect structures. Capacitor structures with a polyimide dielectric were measured up to a 1GHz frequency and 220°C temperature. Polyimides were concluded to be compatible for use in high performance systems such as multilayer interconnect structures.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectPolyimides -- Electric properties.en_US
dc.subjectPolyimides -- Thermal properties.en_US
dc.subjectDielectric measurements.en_US
dc.subjectVery high speed integrated circuits -- Materials -- Electric properties.en_US
dc.subjectVery high speed integrated circuits -- Materials -- Thermal properties.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.identifier.proquest1331453en_US
dc.identifier.oclc18611685en_US
dc.identifier.bibrecord.b18396380en_US
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