Persistent Link:
http://hdl.handle.net/10150/274815
Title:
DENUDED ZONES IN CZOCHRALSKI SILICON WAFERS.
Author:
Wang, Ping, 1953-
Issue Date:
1983
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Type:
text; Thesis-Reproduction (electronic)
Keywords:
Transmission electron microscopes.; Electron microscopy.; Optical measurements.; Semiconductor wafers -- Defects.; Semiconductor wafers -- Testing.
Degree Name:
M.S.
Degree Level:
masters
Degree Program:
Graduate College; Metallurgical Engineering
Degree Grantor:
University of Arizona

Full metadata record

DC FieldValue Language
dc.language.isoen_USen_US
dc.titleDENUDED ZONES IN CZOCHRALSKI SILICON WAFERS.en_US
dc.creatorWang, Ping, 1953-en_US
dc.contributor.authorWang, Ping, 1953-en_US
dc.date.issued1983en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.subjectTransmission electron microscopes.en_US
dc.subjectElectron microscopy.en_US
dc.subjectOptical measurements.en_US
dc.subjectSemiconductor wafers -- Defects.en_US
dc.subjectSemiconductor wafers -- Testing.en_US
thesis.degree.nameM.S.en_US
thesis.degree.levelmastersen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineMetallurgical Engineeringen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.identifier.proquest1320932en_US
dc.identifier.oclc11102435en_US
dc.identifier.bibrecord.b14655093en_US
dc.identifier.bibrecord.b14655081en_US
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