Modeling and Characterization of Plane Pair Structures in High-Speed Power Delivery Systems

Persistent Link:
http://hdl.handle.net/10150/195454
Title:
Modeling and Characterization of Plane Pair Structures in High-Speed Power Delivery Systems
Author:
Chen, Guang
Issue Date:
2006
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
The power/ground plane structure within an electronic system not only delivers power, but also provides return path for the currents associated with the propagating signals. The cavity resonances within the power/ground plane structure affect the signal integrity of the system at high frequencies. The chip complexity and clock speed continue to increase and new structures, such as meshed planes and electromagnetic bandgap structures, are used in plane pair structure design. The signal integrity analysis of the power/ground plane structure becomes exceedingly important and challenging.The primary goal of this research is an in-depth investigation of the impact of the cavity resonances associated with the plane pair structure on the signal integrity. This includes development of modeling, simulation, and measurement methodologies for accurate and efficient characterization or prediction of the time/frequency domain electrical characteristics of power/ground plane pair structures. This research is divided into three parts. First, new SPICE compatible models are proposed for the new structures, such as the meshed plane and EBG embedded plane pair designs, so that the power/ground plane designs with these new structures can be simulated efficiently. Second, the accuracy of the simulation results is vital. The behavior of the benchmark structures is simulated and simulation results are verified either experimentally or by comparing with those from tools that are proven to be accurate. Third, high frequency measurement data is vulnerable to all parasitic parameters. The factors that affect the accuracy of measured data are investigated and methods to improve the accuracy of the measured data are proposed and verified.
Type:
text; Electronic Dissertation
Keywords:
Power/Ground Plane Pair; Signal Integirty; Cavity Resonance; Electromagnetic Bandgap
Degree Name:
PhD
Degree Level:
doctoral
Degree Program:
Electrical & Computer Engineering; Graduate College
Degree Grantor:
University of Arizona
Advisor:
Melde, Kathleen L.
Committee Chair:
Melde, Kathleen L.

Full metadata record

DC FieldValue Language
dc.language.isoENen_US
dc.titleModeling and Characterization of Plane Pair Structures in High-Speed Power Delivery Systemsen_US
dc.creatorChen, Guangen_US
dc.contributor.authorChen, Guangen_US
dc.date.issued2006en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThe power/ground plane structure within an electronic system not only delivers power, but also provides return path for the currents associated with the propagating signals. The cavity resonances within the power/ground plane structure affect the signal integrity of the system at high frequencies. The chip complexity and clock speed continue to increase and new structures, such as meshed planes and electromagnetic bandgap structures, are used in plane pair structure design. The signal integrity analysis of the power/ground plane structure becomes exceedingly important and challenging.The primary goal of this research is an in-depth investigation of the impact of the cavity resonances associated with the plane pair structure on the signal integrity. This includes development of modeling, simulation, and measurement methodologies for accurate and efficient characterization or prediction of the time/frequency domain electrical characteristics of power/ground plane pair structures. This research is divided into three parts. First, new SPICE compatible models are proposed for the new structures, such as the meshed plane and EBG embedded plane pair designs, so that the power/ground plane designs with these new structures can be simulated efficiently. Second, the accuracy of the simulation results is vital. The behavior of the benchmark structures is simulated and simulation results are verified either experimentally or by comparing with those from tools that are proven to be accurate. Third, high frequency measurement data is vulnerable to all parasitic parameters. The factors that affect the accuracy of measured data are investigated and methods to improve the accuracy of the measured data are proposed and verified.en_US
dc.typetexten_US
dc.typeElectronic Dissertationen_US
dc.subjectPower/Ground Plane Pairen_US
dc.subjectSignal Integirtyen_US
dc.subjectCavity Resonanceen_US
dc.subjectElectromagnetic Bandgapen_US
thesis.degree.namePhDen_US
thesis.degree.leveldoctoralen_US
thesis.degree.disciplineElectrical & Computer Engineeringen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorMelde, Kathleen L.en_US
dc.contributor.chairMelde, Kathleen L.en_US
dc.contributor.committeememberXin, Haoen_US
dc.contributor.committeememberDvorak, Steven L.en_US
dc.identifier.proquest1827en_US
dc.identifier.oclc659746352en_US
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