Novel and Efficient Numerical Analysis of Packaging Interconnects in Layered Media

Persistent Link:
http://hdl.handle.net/10150/195320
Title:
Novel and Efficient Numerical Analysis of Packaging Interconnects in Layered Media
Author:
Zhu, Zhaohui
Issue Date:
2005
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
Technology trends toward lower power, higher speed and higher density devices have pushed the package performance to its limits. The high frequency effects e.g., crosstalk and signal distortion, may cause high bit error rates or malfunctioning of the circuit. Therefore, the successful release of a new product requires constant attention to the high frequency effects through the whole design process. Full-wave electromagnetic tools must be used for this purpose. Unfortunately, currently available full-wave tools require excessive computational resources to simulate large-scale interconnect structures.A prototype version of the Full-Wave Layered-Interconnect Simulator (UA-FWLIS), which employs the Method of Moments (MoM) technique, was developed in response to this design need. Instead of using standard numerical integration techniques, the MoM reaction elements were analytically evaluated, thereby greatly improving the computational efficiency of the simulator. However, the expansion and testing functions that are employed in the prototype simulator involve filamentary functions across the wire. Thus, many problems cannot be handled correctly. Therefore, a fundamental extension is made in this dissertation to incorporate rectangular-based, finite-width expansion and testing functions into the simulator. The critical mathematical issues and theoretical issues that were met during the extension are straightened out. The breakthroughs that were accomplished in this dissertation lay the foundation for future extensions. A new bend-cell expansion function is also introduced, thus allowing the simulator to handle bends on the interconnects with fewer unknowns. In addition, the Incomplete Lipschitz-Hankel integrals, which are used in the analytical solution, are studied. Two new series expansions were also developed to improve the computational efficiency and accuracy.
Type:
text; Electronic Dissertation
Keywords:
Method of Moments; Packaging Interconnect; Layered Media; Electromagnetics; Incomplete Lipschitz-Hankel Integral; Special Function
Degree Name:
PhD
Degree Level:
doctoral
Degree Program:
Electrical & Computer Engineering; Graduate College
Degree Grantor:
University of Arizona
Advisor:
Dvorak, Steven L.; Prince, John
Committee Chair:
Dvorak, Steven L.; Prince, John

Full metadata record

DC FieldValue Language
dc.language.isoENen_US
dc.titleNovel and Efficient Numerical Analysis of Packaging Interconnects in Layered Mediaen_US
dc.creatorZhu, Zhaohuien_US
dc.contributor.authorZhu, Zhaohuien_US
dc.date.issued2005en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractTechnology trends toward lower power, higher speed and higher density devices have pushed the package performance to its limits. The high frequency effects e.g., crosstalk and signal distortion, may cause high bit error rates or malfunctioning of the circuit. Therefore, the successful release of a new product requires constant attention to the high frequency effects through the whole design process. Full-wave electromagnetic tools must be used for this purpose. Unfortunately, currently available full-wave tools require excessive computational resources to simulate large-scale interconnect structures.A prototype version of the Full-Wave Layered-Interconnect Simulator (UA-FWLIS), which employs the Method of Moments (MoM) technique, was developed in response to this design need. Instead of using standard numerical integration techniques, the MoM reaction elements were analytically evaluated, thereby greatly improving the computational efficiency of the simulator. However, the expansion and testing functions that are employed in the prototype simulator involve filamentary functions across the wire. Thus, many problems cannot be handled correctly. Therefore, a fundamental extension is made in this dissertation to incorporate rectangular-based, finite-width expansion and testing functions into the simulator. The critical mathematical issues and theoretical issues that were met during the extension are straightened out. The breakthroughs that were accomplished in this dissertation lay the foundation for future extensions. A new bend-cell expansion function is also introduced, thus allowing the simulator to handle bends on the interconnects with fewer unknowns. In addition, the Incomplete Lipschitz-Hankel integrals, which are used in the analytical solution, are studied. Two new series expansions were also developed to improve the computational efficiency and accuracy.en_US
dc.typetexten_US
dc.typeElectronic Dissertationen_US
dc.subjectMethod of Momentsen_US
dc.subjectPackaging Interconnecten_US
dc.subjectLayered Mediaen_US
dc.subjectElectromagneticsen_US
dc.subjectIncomplete Lipschitz-Hankel Integralen_US
dc.subjectSpecial Functionen_US
thesis.degree.namePhDen_US
thesis.degree.leveldoctoralen_US
thesis.degree.disciplineElectrical & Computer Engineeringen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorDvorak, Steven L.en_US
dc.contributor.advisorPrince, Johnen_US
dc.contributor.chairDvorak, Steven L.en_US
dc.contributor.chairPrince, Johnen_US
dc.contributor.committeememberZiolkowski, Richard W.en_US
dc.contributor.committeememberPalusinski, Olgired A.en_US
dc.contributor.committeememberCao, Yien_US
dc.identifier.proquest1163en_US
dc.identifier.oclc659747440en_US
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