FUNDAMENTAL CHARACTERIZATION OF TRIBOLOGICAL, THERMAL, FLUID DYNAMIC AND WEAR ATTRIBUTES OF CONSUMABLES IN CHEMICAL MECHANICAL PLANARIZATION

Persistent Link:
http://hdl.handle.net/10150/195125
Title:
FUNDAMENTAL CHARACTERIZATION OF TRIBOLOGICAL, THERMAL, FLUID DYNAMIC AND WEAR ATTRIBUTES OF CONSUMABLES IN CHEMICAL MECHANICAL PLANARIZATION
Author:
Wei, Xiaomin
Issue Date:
2010
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
This dissertation presents several studies relating to fundamental characterization of CMP consumables in planarization processes. These are also evaluated with the purposes of minimizing environmental impact and reducing cost of ownership (COO).The first study is conducted to obtain the retaining ring wear rate in a typical ILD CMP process and is specifically intended to investigate the effect of retaining ring materials and slot designs during the CMP process. The results show that retaining ring materials have effect on the COF, pad temperature and retaining ring wear rate, while retaining ring slot designs affect the pad surface abruptness. The second study is performed to compare the effect of different retaining ring slot designs on the slurry film thickness within the pad-wafer interface. A novel non-intrusive optical technique, dual emission UV-enhanced fluorescence (DEUVEF), was applied to accurately measure the film thickness of the slurry underneath the wafer during polishing. It is indicated that the optimized retaining ring slot design can significantly reduce the COO of CMP processes by increasing slurry utilization.A COF method is applied to measure the slurry mean residence time (MRT) during CMP. This technique uses transient COF data induced by a shift in slurry concentration to determine MRT. Variations in consumables as well as sliding velocity, pressure and slurry flow rate can affect the slurry MRT. One study in this dissertation focus on the effect of retaining ring slot designs on the slurry MRT. Another study compares the slurry MRT under same polishing conditions using pads with different groove width. Both studies are conducted on multiple sliding velocity, pressure and slurry flow rate variations to understand the characteristics of consumable designs. The method of measuring MRT during polishing presented in this dissertation can be easily applied in general CMP processes.The subsequent studies focus in the diamond conditioner discs characterization techniques. A newly developed method for determining active diamonds and aggressive diamonds on a diamond conditioner disc under a certain vertical load is elaborated in this dissertation. Later, this technique together with scanning electron microscopy (SEM) imaging is implemented to analyze diamond pullout and fracture in CMP. Five different types of diamond conditioner discs are subjected to a novel accelerated wear test respectively to compare the extent of diamond pullout and fracture under the same conditioning condition
Type:
text; Electronic Dissertation
Keywords:
CMP; mean residence time; retaining ring
Degree Name:
Ph.D.
Degree Level:
doctoral
Degree Program:
Chemical Engineering; Graduate College
Degree Grantor:
University of Arizona
Committee Chair:
Philipossian, Ara

Full metadata record

DC FieldValue Language
dc.language.isoenen_US
dc.titleFUNDAMENTAL CHARACTERIZATION OF TRIBOLOGICAL, THERMAL, FLUID DYNAMIC AND WEAR ATTRIBUTES OF CONSUMABLES IN CHEMICAL MECHANICAL PLANARIZATIONen_US
dc.creatorWei, Xiaominen_US
dc.contributor.authorWei, Xiaominen_US
dc.date.issued2010en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThis dissertation presents several studies relating to fundamental characterization of CMP consumables in planarization processes. These are also evaluated with the purposes of minimizing environmental impact and reducing cost of ownership (COO).The first study is conducted to obtain the retaining ring wear rate in a typical ILD CMP process and is specifically intended to investigate the effect of retaining ring materials and slot designs during the CMP process. The results show that retaining ring materials have effect on the COF, pad temperature and retaining ring wear rate, while retaining ring slot designs affect the pad surface abruptness. The second study is performed to compare the effect of different retaining ring slot designs on the slurry film thickness within the pad-wafer interface. A novel non-intrusive optical technique, dual emission UV-enhanced fluorescence (DEUVEF), was applied to accurately measure the film thickness of the slurry underneath the wafer during polishing. It is indicated that the optimized retaining ring slot design can significantly reduce the COO of CMP processes by increasing slurry utilization.A COF method is applied to measure the slurry mean residence time (MRT) during CMP. This technique uses transient COF data induced by a shift in slurry concentration to determine MRT. Variations in consumables as well as sliding velocity, pressure and slurry flow rate can affect the slurry MRT. One study in this dissertation focus on the effect of retaining ring slot designs on the slurry MRT. Another study compares the slurry MRT under same polishing conditions using pads with different groove width. Both studies are conducted on multiple sliding velocity, pressure and slurry flow rate variations to understand the characteristics of consumable designs. The method of measuring MRT during polishing presented in this dissertation can be easily applied in general CMP processes.The subsequent studies focus in the diamond conditioner discs characterization techniques. A newly developed method for determining active diamonds and aggressive diamonds on a diamond conditioner disc under a certain vertical load is elaborated in this dissertation. Later, this technique together with scanning electron microscopy (SEM) imaging is implemented to analyze diamond pullout and fracture in CMP. Five different types of diamond conditioner discs are subjected to a novel accelerated wear test respectively to compare the extent of diamond pullout and fracture under the same conditioning conditionen_US
dc.typetexten_US
dc.typeElectronic Dissertationen_US
dc.subjectCMPen_US
dc.subjectmean residence timeen_US
dc.subjectretaining ringen_US
thesis.degree.namePh.D.en_US
thesis.degree.leveldoctoralen_US
thesis.degree.disciplineChemical Engineeringen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.chairPhilipossian, Araen_US
dc.contributor.committeememberSaez, A. Eduardoen_US
dc.contributor.committeememberMuscat, Anthonyen_US
dc.identifier.proquest11313en_US
dc.identifier.oclc752261162en_US
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