Pad-Wafer and Brush-Wafer Contact Characterization in Planarization and Post-Planarization Processes

Persistent Link:
http://hdl.handle.net/10150/194898
Title:
Pad-Wafer and Brush-Wafer Contact Characterization in Planarization and Post-Planarization Processes
Author:
SUN, TING
Issue Date:
2009
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
This dissertation presents a series of studies relating to pad-wafer and brush-wafer contact characterization in planarization and post-planarization processes. These are also evaluated with the purposes of minimizing environmental impact and reducting cost of ownership.Firstly, a new method using spectral analysis based on real-time raw friction data is developed to quantify the total amount of mechanical interaction in the brush-fluid-wafer interface in terms of stick-slip phenomena in post-planarization scrubbing. This new method is remarkable from the standpoint of its potential to eliminate having to perform a multitude of experiments needed for constructing and interpreting Stribeck curves, and its application to processes where Stribeck curves fail to yield any useful data. Moreover, this method is applied to investigate the effect of brush roller design on scrubbing process and to analyze behaviors of eccentric brushes.In order to study pad-wafer contact in planarization processes, a mechanical characterization method (incremental loading test) is developed and applied to analyze different types of pads and pad surfaces subjected to various treatments. Along with optical interferometry and theoretical analysis, flow resistance due to pad land area topography can be estimated.The greatest contribution of this dissertation involves development of real pad-wafer contact area measurement technique using confocal microscopy. The real pad-wafer contact area is a difficult property to measure in planarization, yet it is a key feature to further understand the process. A custom-made sample holder with a sapphire window and a miniature load cell is used to collect confocal images at controlled values of down force.At last, the two newly developed techniques (incremental loading test and real pad-wafer contact area measurement using confocal microscopy) together with dual emission UV enhanced fluorescence imaging are utilized to investigate conditioning effects in planarization process.
Type:
text; Electronic Dissertation
Keywords:
CMP; pad-wafer contact; post-CMP scrubbing
Degree Name:
Ph.D.
Degree Level:
doctoral
Degree Program:
Chemical Engineering; Graduate College
Degree Grantor:
University of Arizona
Advisor:
Philipossian, Ara
Committee Chair:
Philipossian, Ara

Full metadata record

DC FieldValue Language
dc.language.isoENen_US
dc.titlePad-Wafer and Brush-Wafer Contact Characterization in Planarization and Post-Planarization Processesen_US
dc.creatorSUN, TINGen_US
dc.contributor.authorSUN, TINGen_US
dc.date.issued2009en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThis dissertation presents a series of studies relating to pad-wafer and brush-wafer contact characterization in planarization and post-planarization processes. These are also evaluated with the purposes of minimizing environmental impact and reducting cost of ownership.Firstly, a new method using spectral analysis based on real-time raw friction data is developed to quantify the total amount of mechanical interaction in the brush-fluid-wafer interface in terms of stick-slip phenomena in post-planarization scrubbing. This new method is remarkable from the standpoint of its potential to eliminate having to perform a multitude of experiments needed for constructing and interpreting Stribeck curves, and its application to processes where Stribeck curves fail to yield any useful data. Moreover, this method is applied to investigate the effect of brush roller design on scrubbing process and to analyze behaviors of eccentric brushes.In order to study pad-wafer contact in planarization processes, a mechanical characterization method (incremental loading test) is developed and applied to analyze different types of pads and pad surfaces subjected to various treatments. Along with optical interferometry and theoretical analysis, flow resistance due to pad land area topography can be estimated.The greatest contribution of this dissertation involves development of real pad-wafer contact area measurement technique using confocal microscopy. The real pad-wafer contact area is a difficult property to measure in planarization, yet it is a key feature to further understand the process. A custom-made sample holder with a sapphire window and a miniature load cell is used to collect confocal images at controlled values of down force.At last, the two newly developed techniques (incremental loading test and real pad-wafer contact area measurement using confocal microscopy) together with dual emission UV enhanced fluorescence imaging are utilized to investigate conditioning effects in planarization process.en_US
dc.typetexten_US
dc.typeElectronic Dissertationen_US
dc.subjectCMPen_US
dc.subjectpad-wafer contacten_US
dc.subjectpost-CMP scrubbingen_US
thesis.degree.namePh.D.en_US
thesis.degree.leveldoctoralen_US
thesis.degree.disciplineChemical Engineeringen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorPhilipossian, Araen_US
dc.contributor.chairPhilipossian, Araen_US
dc.contributor.committeememberMuscat, Anthonyen_US
dc.contributor.committeememberOgden, Kimberlyen_US
dc.contributor.committeememberLynch, David C.en_US
dc.identifier.proquest10400en_US
dc.identifier.oclc659752016en_US
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