Thin layer with circular debonding over a substrate under either axisymmetric compression or thermal loading.

Persistent Link:
http://hdl.handle.net/10150/187500
Title:
Thin layer with circular debonding over a substrate under either axisymmetric compression or thermal loading.
Author:
Balkan, Haluk.
Issue Date:
1996
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
The objective of this dissertation is to present analytical solutions to the problem of a circular debonded thin film on a substrate subjected to either axisymmetric compressive stress or uniform thermal loading. In the case of the axisymmetric compressive stress, the solution method utilizes the three-dimensional equations of elastic stability while allowing the debonded region to be slightly open. The in-plane axisymmetric compressive stress is present only in the thin film. In the case of thermal loading, both the film and the substrate are subjected to the same uniform temperature variation. The solutions to both cases are obtained by using mathematical techniques appropriate to mixed boundary value problems in the theory of elasticity where the governing equations are obtained as a system of singular integral equations. These equations are then reduced to a system of algebraic equations leading to the determination of the stress intensity factors and the corresponding phase angles.
Type:
text; Dissertation-Reproduction (electronic)
Degree Name:
Ph.D.
Degree Level:
doctoral
Degree Program:
Aerospace and Mechanical Engineering; Graduate College
Degree Grantor:
University of Arizona
Committee Chair:
Madenci, Erdogan

Full metadata record

DC FieldValue Language
dc.language.isoenen_US
dc.titleThin layer with circular debonding over a substrate under either axisymmetric compression or thermal loading.en_US
dc.creatorBalkan, Haluk.en_US
dc.contributor.authorBalkan, Haluk.en_US
dc.date.issued1996en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThe objective of this dissertation is to present analytical solutions to the problem of a circular debonded thin film on a substrate subjected to either axisymmetric compressive stress or uniform thermal loading. In the case of the axisymmetric compressive stress, the solution method utilizes the three-dimensional equations of elastic stability while allowing the debonded region to be slightly open. The in-plane axisymmetric compressive stress is present only in the thin film. In the case of thermal loading, both the film and the substrate are subjected to the same uniform temperature variation. The solutions to both cases are obtained by using mathematical techniques appropriate to mixed boundary value problems in the theory of elasticity where the governing equations are obtained as a system of singular integral equations. These equations are then reduced to a system of algebraic equations leading to the determination of the stress intensity factors and the corresponding phase angles.en_US
dc.typetexten_US
dc.typeDissertation-Reproduction (electronic)en_US
thesis.degree.namePh.D.en_US
thesis.degree.leveldoctoralen_US
thesis.degree.disciplineAerospace and Mechanical Engineeringen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.chairMadenci, Erdoganen_US
dc.contributor.committeememberHeinrich, Juan C.en_US
dc.contributor.committeememberChen, Weinongen_US
dc.contributor.committeememberDesai, Chandrakanten_US
dc.identifier.proquest9626539en_US
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