The effects of losses for electrical interconnections in VLSI packaging environments.

Persistent Link:
http://hdl.handle.net/10150/185752
Title:
The effects of losses for electrical interconnections in VLSI packaging environments.
Author:
Voranantakul, Suwan.
Issue Date:
1992
Publisher:
The University of Arizona.
Rights:
Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
Abstract:
The effects of losses for electrical interconnections in VLSI packaging environments have been investigated in terms of attenuation, dispersion, propagation delay, reflection, crosstalk, overshoot/undershoot and ground noise resonance. Three types of loss are considered here; they are conductor loss (due to either DC loss or skin effect loss), dielectric loss and insertion loss. The advantages and disadvantages of either conductor loss or dielectric loss in signal propagation are examined. The model for ground noise resonance effect in nonuniformly coupled ribbon cables is first introduced, and then one of the more practical solutions to this problem is demonstrated by applying insertion loss to the cables at the resonant frequency. General design guidelines and parameter trade-off considerations for preserving signal integrity (i.e., less signal distortion and lower coupled noise) during transmission are also included.
Type:
text; Dissertation-Reproduction (electronic)
Keywords:
Dissertations, Academic.; Electrical engineering.
Degree Name:
Ph.D.
Degree Level:
doctoral
Degree Program:
Electrical and Computer Engineering; Graduate College
Degree Grantor:
University of Arizona
Advisor:
Prince, John L.

Full metadata record

DC FieldValue Language
dc.language.isoenen_US
dc.titleThe effects of losses for electrical interconnections in VLSI packaging environments.en_US
dc.creatorVoranantakul, Suwan.en_US
dc.contributor.authorVoranantakul, Suwan.en_US
dc.date.issued1992en_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.description.abstractThe effects of losses for electrical interconnections in VLSI packaging environments have been investigated in terms of attenuation, dispersion, propagation delay, reflection, crosstalk, overshoot/undershoot and ground noise resonance. Three types of loss are considered here; they are conductor loss (due to either DC loss or skin effect loss), dielectric loss and insertion loss. The advantages and disadvantages of either conductor loss or dielectric loss in signal propagation are examined. The model for ground noise resonance effect in nonuniformly coupled ribbon cables is first introduced, and then one of the more practical solutions to this problem is demonstrated by applying insertion loss to the cables at the resonant frequency. General design guidelines and parameter trade-off considerations for preserving signal integrity (i.e., less signal distortion and lower coupled noise) during transmission are also included.en_US
dc.typetexten_US
dc.typeDissertation-Reproduction (electronic)en_US
dc.subjectDissertations, Academic.en_US
dc.subjectElectrical engineering.en_US
thesis.degree.namePh.D.en_US
thesis.degree.leveldoctoralen_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.grantorUniversity of Arizonaen_US
dc.contributor.advisorPrince, John L.en_US
dc.contributor.committeememberCangellaris, Andreas C.en_US
dc.contributor.committeememberJones, Roger C.en_US
dc.identifier.proquest9220680en_US
dc.identifier.oclc712069398en_US
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